Industrial Automation

Contact

Industrial Automation

Enhancing inspection of PCB attachment to power inverter

Omron’s innovative inspection technology recognizes the power module is a critical part of EV subassembly and allows for accuracy as well as speed when measuring each solder area during PCB attachment. Our solution improves inspection results while simultaneously optimizing product quality.

Challenge

For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.

Solution

Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron’s VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.

Fast x-ray inspection

Inspect several layers of solder paste condition and thickness by Full 3D CT inspection.

Related Products

VT-X750 3D CT X-RAY

The X750 is used for non-destructive inspection of 5G infrastructure / modules and in-vehicle electrical components as a high-definition, high-quality inspection using full 3D-CT.

Contact us today, and begin the process of revolutionizing your EV application

Download E-book
Contact Us

Products

About Us

Solutions

Privacy

Services

Resources

Omron Automation is an industrial automation partner that creates, sells and services fully integrated automation solutions that include sensing, control, safety, vision, motion, robotics and more.

Follow Us

Youtube Facebook Linkedin

COPYRIGHT 2024 @ OMRON CORPORATION. ALL RIGHTS RESERVED.

Industrial Automation

Contact Us
Facebook Twitter Youtube Instagram