Industrial Automation

Industrial Automation

PCB Inspection System

VP9000

The VP9000 uses highly accurate and repeatable 3D imaging to perform complete PCB solder paste analysis. Potential PCB warpage is calculated at each inspection point and automatically compensated for prioritisation to analysis. The combination of features achieve ultra-precise volume measurements with an high accuracy.

Features

  • High-Speed 100% 3D Solder Paste Inspection
  • Highly Accurate Solder Paste Volume Measurement (within 2%)
  • Multiple Resolution Options and 3-Mode Zoom (down to 5µm)
  • Two Available Machine Sizes to Handle PCBs Ranging from 250mm x 330mm to 460mm x 510mm
  • User-Friendly Software and Integrated, Touch-Screen Interface
  • Simple Program Creation from GERBER and/or Mount Data (compatible with ePM)
  • Full Offline Program Generation
  • Real-Time Process Monitoring
  • Data Analysis and Quality Control Software Tools (compatible with Omron Q-Up Navi software)
  • Glue and Foreign Material Inspection.

VP9000 3D Solder Paste Inspection Machine

VP9000 SPI Inspection Product Demonstration