Industrial Automation
3D Solder Joint Inspection System
The VT-S530 provides Full 3D-AOI capability, High performance, Highest First Pass Yield, Zero Escape and lowest False Rejects amongst other strengths.
With the ability to perform pre or post reflow inspection, handle large format samples, and optional dual-lane configuration, the VT-S530 handles any production environment. Built-in 3D and 2D inspection technologies measure ensure every solder joint while adhering to industrial IPC. Watch this Video showing our S530 and its main features and applications!
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